MacroFab, Inc.

What We Do

PCBA Production Capabilities

Built In North America

PCB Fabrication

  • 2-36 layers
  • Blind, buried, micro-drilled vias
  • High-Density Interconnect (HDI)
  • Controlled impedance
  • Castellations
  • Flip-chip capable
  • Encapsulating (Epoxy potting)

PCB and Product Assembly

  • Through-hole, SMD, hybrid, modules
  • Full product box build assemblies
  • Double-sided assembly by default
  • Conformal Coating
  • Cable and wire harness Minimal component size 01005
  • IPC-A-610 Class 2 and 3

Engineering Services

  • PCB Design Review
  • DRC and DFM
  • File conversion and management

Testing and Validation

  • Component Programming and Flashing
  • Functional testing
  • In-Circuit Testing (ICT)
  • Burn-in
  • Flying probe
  • RF spectrum testing

Component Sourcing

  • Real-time stock visibility
  • Integrated component suppliers
  • Turnkey Component Sourcing
  • Customer Supplied Inventory Support
  • Consignment Support
  • Alternative sourcing
  • Component Lifecycle management

PCB Specifications

Capabilities

Layer Count and Stackups

  • 2-36 Layers
  • Default and Custom Stackups Available

Surface Finish

  • ENIG (standard)
  • ENIPIG
  • Lead-Free HASL
  • EHG

Materials

  • FR4-TG1785 (standard)
  • Rogers 4003C
  • Rogers 4350B
  • Rogers 4450B
  • Aluminum
  • Other materials possible - contact for details

Copper Weight

  • ½ oz (18µm)
  • 1 oz (35µm)
  • 2 oz(70µm)
  • Other weights possible - contact for details

Soldermask & Silkscreen Colors

  • All Standard Colors
  • Custom colors available on request

Fabrication Processes

  • Plated Slots
  • Impedance Control
  • Hard Gold
  • Edge Fingers
  • Beveled Edges
  • Blind, Buried, Micro-Drilled, Back-Drilled Vias
  • Via in Pad - Epoxy Filled and Capped Vias
  • Castellations

Via Fill Options

  • Soldermask Tented
  • Non-Conductive Epoxy
  • Conductive Epoxy
  • Copper

Board Area

  • Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)
  • Minimum billable area: 1 square inch (25.4mm²)
  • Larger boards possible - contact for details

Board Thickness

  • 0.062” (1.6mm) standard
  • 0.008”-0.248” (0.2mm-6.3mm) custom

PCB Assembly

Capabilities

Solder Types

  • RoHS/Lead-Free Solder Only
  • SAC305 for Surface Mount
  • SN100 Only for Through-Hole

Flux Types

  • SMT: no-clean
  • Through-Hole: no-clean or water wash

Assembly Supported

  • Single-Sided or Double-Sided
  • Through-Hole (PTH)
  • SMD
  • BGA
  • LGA
  • SoP
  • Modules and Daughterboard

Mechanical Component Limits

  • Chip Components, ex: resistors/ capacitors
    • 01005 10 mil x 05 mil (0.25mm x 0.0125mm)
  • Leaded Packages, ex: SOIC/QFP/TSOP
    • 11.8 mil (0.3mm) Lead Pitch
  • Leadless Packages, ex: QFN, TQFN
    • 11.8 mil (0.3mm) Lead Pitch
  • BGA, ex: BGA/FBGA/LGA
    • 15.7 mil (0.4mm) Ball Pitch

Depanelization

  • V-Score and Linear Blade
  • Mouse Bites
  • Fully Routed

Machines and Processes

  • Solder Paste Screen Printers
  • Solder Paste Jet Printers
  • SMT Pick and Place machines
  • Convection Reflow Ovens
  • Automatic Optical Inspection
  • PCB Automatic Board Washers
  • Selective and Wave Through Hole Soldering
  • X-Ray inspection

Box Build and Testing

Capabilities

Conformal Coating

  • Spray and Dipping Processes
  • UV Tracer and Coverage Checks
  • Materials: Acrylic, Silicone, Polyurethane

Component Programming

  • Pre-Assembly Flashing
  • In-Circuit Programming
  • All major microcontroller programming supported

Full Product Assembly

  • Labels and Serialization
  • Epoxy Encasement
  • Enclosure Assembly
  • Packaging and Documentation

Testing and Validation

  • Full Functional
  • In-Circuit Testing (ICT)
  • Burn-In Cycles
  • Flying Probe
  • RF Spectrum Testing

Design Rules (DRC)

Capabilities

Design Minimums

  • Trace Width - 3 mil (0.0762mm)
  • Spacing - 3 mil (0.0762mm)
  • Annular Ring - 3 mil (0.0762mm)
  • Clearance: Copper to Edge of Board - 3 mil (0.0762mm)
  • Drill Size - 4 mil (0.1016mm)
  • NPTH Drill to Drill - 6 mil (0.1524mm)
  • PTH Drill to Drill - 19.69 mil (0.5mm)
  • Paste Aperture - 6 mil (0.1524mm)
  • Paste Clearance - 6 mil (0.1524mm)
  • Silkscreen Size - 5 mil (0.127mm)
  • Silkscreen Text Height - 32 mil (0.8mm)
  • Soldermask Dam - 3.93 mil (0.1mm)
  • External Route Radius - 39.37 mil (1.0mm)
  • Internal Route Radius - 31.49 mil (0.8mm)

Tolerances

  • Board thickness tolerance:
    • T < 1.0mm: ±15%
    • 1.0 > T<1.6mm: ±10%
    • T>1.6mm: ±10%
  • PCB Board Edge
    • ± 6 mil (0.15mm)
  • NPTH Drill Hole Size
    • ± 2 mil (0.05mm)
  • PTH Drill Hole Size
    • ± 3.15 mil (0.08mm)

Quality and Certifications

Capabilities

MacroFab Manufacturing Guarantee

  • Workmanship for one year after manufacturing
  • Information and Intellectual Property is 100% confidential
  • Transparent communication and order visibility
  • Whatever it takes to get it right - for free

Inspection

  • Visual Inspection on All Assemblies
  • First Article Inspection Images for Customer/ Engineering Review
  • X-Ray for Underpackage Leads (BGA And QFN) and Engineering Validation
  • Automated Op

IPC-A-610H

  • All assemblies are built to meet IPC-A-610H Class 2 with Class 3 available

MacroFab Facility Certifications

  • ISO9001:2015
  • IPC class 2 and 3 Production
  • ITAR Registered

Partner Facility Certifications

  • AS9100D
  • UL Registered
  • IPC class 2 and 3 Production
  • ISO13485
  • ISO/IATF 16949
  • ISO9001
  • ISO14001

IPC-A-610

  • ESD Safety Procedures
  • PCB Assemblies Meet Class 2 with Class 3 Available

Learn More About PCBA Capabilities

Six pcba design trends to watch in 2023

Six PCBA Design Trends to Watch in 2023

Engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.

Choose optimal contract manufacturer product prototyping

Choose the Optimal Electronics Manufacturer for New Product Prototyping

As new technologies, capabilities, and manufacturing equipment come into play, the prototyping phase validates the functionality of a new product.

Altimade Fuses Design with Manufacturing

Altimade Fuses Design with Manufacturing

Taking a new design from concept to manufacturing can be difficult, and transferring files to the manufacturer can take unprecedented blocks of time.

Capabilities sales assisted

Sourcing, Fabrication, Assembly & Testing Capabilities

MacroFab capabilities include fine-pitch BGA, HDI, and QFN assembly. Download this document for an overview of our fabrication and assembly specifications.