What We Do

PCBA Production Capabilities

Built In North America

Download the PDF Version

PCB Fabrication

2-36 layers

Blind, buried, micro-drilled vias

High-Density Interconnect (HDI)

Controlled impedance

Castellations

Flip-chip capable

Encapsulating (Epoxy potting)

PCB and Product Assembly

Through-hole, SMD, hybrid, modules

Full product box build assemblies

Double-sided assembly by default

Conformal Coating

Cable and wire harness Minimal component size 01005

IPC-A-610 Class 2 and 3

Engineering Services

PCB Design Review

DRC and DFM

File conversion and management

Testing and Validation

Component Programming and Flashing

Functional testing

In-Circuit Testing (ICT)

Burn-in

Flying probe

RF spectrum testing

Component Sourcing

Real-time stock visibility

Integrated component suppliers

Turnkey Component Sourcing

Customer Supplied Inventory Support

Consignment Support

Alternative sourcing

Component Lifecycle management

PCB Specifications

Capabilities

Layer Count and Stackups

2-36 Layers

Default and Custom Stackups Available

Surface Finish

ENIG (standard)

ENIPIG

Lead-Free HASL

EHG

Materials

FR4-TG175 (standard)

Rogers 4003C

Rogers 4350B

Rogers 4450B

Aluminum

Other materials possible - contact for details

Copper Weight

½ oz (18µm)

1 oz (35µm)

2 oz(70µm)

Other weights possible - contact for details

Soldermask & Silkscreen Colors

All Standard Colors

Custom colors available on request

Fabrication Processes

Plated Slots

Impedance Control

Hard Gold

Edge Fingers

Beveled Edges

Blind, Buried, Micro-Drilled, Back-Drilled Vias

Via in Pad - Epoxy Filled and Capped Vias

Castellations

Via Fill Options

Soldermask Tented

Non-Conductive Epoxy

Conductive Epoxy

Copper

Board Area

Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)

Minimum billable area: 1 square inch (25.4mm²)

Larger boards possible - contact for details

Board Thickness

0.062” (1.6mm) standard

0.008”-0.248” (0.2mm-6.3mm) custom

PCB Assembly

Capabilities

Solder Types

RoHS/Lead-Free Solder Only

SAC305 for Surface Mount

SN100 Only for Through-Hole

Flux Types

SMT: no-clean

Through-Hole: no-clean or water wash

Assembly Supported

Single-Sided or Double-Sided

Through-Hole (PTH)

SMD

BGA

LGA

SoP

Modules and Daughterboard

Mechanical Component Limits

Chip Components, ex: resistors/ capacitors

01005 10 mil x 05 mil (0.25mm x 0.0125mm)

Leaded Packages, ex: SOIC/QFP/TSOP

11.8 mil (0.3mm) Lead Pitch

Leadless Packages, ex: QFN, TQFN

11.8 mil (0.3mm) Lead Pitch

BGA, ex: BGA/FBGA/LGA

15.7 mil (0.4mm) Ball Pitch

Depanelization

V-Score and Linear Blade

Mouse Bites

Fully Routed

Machines and Processes

Solder Paste Screen Printers

Solder Paste Jet Printers

SMT Pick and Place machines

Convection Reflow Ovens

Automatic Optical Inspection

PCB Automatic Board Washers

Selective and Wave Through Hole Soldering

X-Ray inspection

Box Build and Testing

Capabilities

Conformal Coating

Spray and Dipping Processes

UV Tracer and Coverage Checks

Materials: Acrylic, Silicone, Polyurethane

Component Programming

Pre-Assembly Flashing

In-Circuit Programming

All major microcontroller programming supported

Full Product Assembly

Labels and Serialization

Epoxy Encasement

Enclosure Assembly

Packaging and Documentation

Testing and Validation

Full Functional

In-Circuit Testing (ICT)

Burn-In Cycles

Flying Probe

RF Spectrum Testing

Design Rules (DRC)

Capabilities

Design Minimums

Trace Width - 3 mil (0.0762mm)

Spacing - 3 mil (0.0762mm)

Annular Ring - 3 mil (0.0762mm)

Clearance: Copper to Edge of Board - 3 mil (0.0762mm)

Drill Size - 4 mil (0.1016mm)

NPTH Drill to Drill - 6 mil (0.1524mm)

PTH Drill to Drill - 19.69 mil (0.5mm)

Paste Aperture - 6 mil (0.1524mm)

Paste Clearance - 6 mil (0.1524mm)

Silkscreen Size - 5 mil (0.127mm)

Silkscreen Text Height - 32 mil (0.8mm)

Soldermask Dam - 3.93 mil (0.1mm)

External Route Radius - 39.37 mil (1.0mm)

Internal Route Radius - 31.49 mil (0.8mm)

Tolerances

Board thickness tolerance:

T < 1.0mm: ±15%
1.0 > T<1.6mm: ±10%
T>1.6mm: ±10%

PCB Board Edge

± 6 mil (0.15mm)

NPTH Drill Hole Size

± 2 mil (0.05mm)

PTH Drill Hole Size

± 3.15 mil (0.08mm)

Quality and Certifications

Capabilities

MacroFab Manufacturing Guarantee

Workmanship for one year after manufacturing

Information and Intellectual Property is 100% confidential

Transparent communication and order visibility

Whatever it takes to get it right - for free

Inspection

Visual Inspection on All Assemblies

First Article Inspection Images for Customer/ Engineering Review

X-Ray for Underpackage Leads (BGA And QFN) and Engineering Validation

Automated Op

IPC-A-610H

All assemblies are built to meet IPC-A-610H Class 2 with Class 3 available

MacroFab Facility Certifications

ISO9001:2015

IPC class 2 and 3 Production

ITAR Registered

Partner Facility Certifications

AS9100D

UL Registered

IPC class 2 and 3 Production

ISO13485

ISO/IATF 16949

ISO9001

ISO14001

IPC-A-610

ESD Safety Procedures

PCB Assemblies Meet Class 2 with Class 3 Available

Learn More About PCBA Capabilities

Choose optimal contract manufacturer product prototyping

Choose the Optimal Electronics Manufacturer for New Product Prototyping

As new technologies, capabilities, and manufacturing equipment come into play, the prototyping phase validates the functionality of a new product.

Sourcing, Fabrication, Assembly & Testing Capabilities

MacroFab capabilities include fine-pitch BGA, HDI, and QFN assembly. Download this document for an overview of our fabrication and assembly specifications.

Six PCBA Design Trends to Watch in 2023

Engineers must continually seek out new options and keep up with market changes. Take note of these six trends within the electronics industry.

Altimade Fuses Design with Manufacturing

Taking a new design from concept to manufacturing can be difficult, and transferring files to the manufacturer can take unprecedented blocks of time.