Buried Via
A buried via represents a specialized type of plated connection used within multilayer printed circuit boards (PCBs). Unlike through-hole vias that pass through the entire board, and blind vias that connect outer layers to some inner layers, buried vias establish electrical pathways solely between inner layers of the PCB. They are not visible from the outer surfaces of the board.
Buried vias are formed during the PCB lamination process and connect designated points within the inner layer stack-up. They enable the creation of high-density interconnect (HDI) PCBs with more components in limited space. Buried vias contribute to better signal integrity by providing shooter, more direct electrical paths within the board as compared to traces routed on outer layers.
Hear how blind and buried vias can impact your PCB assembly costs, and how to avoid this issue.
Categories: Board Parts / Components