Manufacturing Capabilities

World-Class PCBA
Built in North America

Fine-pitch BGA, HDI, QFN, and through-hole assembly up to IPC Class 3. MacroFab's US-based manufacturing facilities are qualified, audited, and ready to build what you need: prototype or production.

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Overview PCB Specifications PCB Assembly Design Rules Quality & Certifications
01 · Capabilities Overview

Fabrication, Assembly,
and Component Sourcing

PCB Fabrication
  • 2–36 layers
  • Blind, buried & micro-drilled vias
  • High-Density Interconnect (HDI)
  • Controlled impedance
  • Castellations
PCB & Product Assembly
  • Through-hole, SMD, hybrid, modules
  • Double-sided by default
  • Minimal component size: 01005
  • Encapsulating (epoxy potting)
  • Conformal coating
  • IPC-A-610 Class 2 and 3 inspection
  • J-STD-001 Assembly
Component Sourcing
  • Real-time stock visibility
  • Integrated component suppliers
  • Turnkey component sourcing
  • Customer supplied inventory support
  • Consignment support
  • Alternative sourcing
  • Component lifecycle management
CAP-01 / OVERVIEW FABRICATION · ASSEMBLY · SOURCING
02 · PCB Specifications

Fabrication Specifications

Layer Count & Stackups
  • 2–36 layers
  • Default and custom stackups available
Surface Finish
  • ENIG (standard)
  • ENIPIG
  • HASL
  • Lead-free HASL
  • EHG
  • Hard gold
  • Edge fingers
Materials
  • FR4-TG178.5 (standard)
  • Rogers 4003C
  • Rogers 4350B
  • Rogers 4450B
  • Aluminum
  • Other materials available; contact for details
Copper Weight
  • ½ oz (18µm)
  • 1 oz (35µm)
  • 2 oz (70µm)
  • Other weights available; contact for details
Soldermask & Silkscreen
  • All standard colors
  • Custom colors available on request
Via Fill Options
  • Soldermask tented
  • Non-conductive epoxy
  • Conductive epoxy
  • Via in pad: epoxy filled and capped
Board Area
  • Minimum billable: 1 in² (25.4mm²)
  • Max dimensions: 14.9" × 14.9" (378.46 × 378.46mm)
  • Larger boards available; contact for details
Board Thickness
  • 0.062" (1.6mm) standard
  • 0.008"–0.248" (0.2–6.3mm) custom
  • Increments at 0.0004" (0.1016mm)
Fabrication Processes
  • Plated slots
  • Impedance control
  • Beveled edges
  • Copper filled vias
  • Blind, buried, micro-drilled, back-drilled vias
Copper Features
  • Internal route radius: 31.49 mil (0.8mm)
  • External route radius: 39.37 mil (1.0mm)
CAP-02 / FABRICATION FR4 · ENIG · HDI · 2–36 LAYERS
03 · PCB Assembly

Assembly Specifications

Solder Types
  • SAC305 for surface mount
  • SN100 for through-hole only
  • Sn63Pb37 / Sn62Pb36Ag2 / Pb93Sn5Ag2 for Specialized and High Performance Products
Flux Types
  • SMT: no-clean / water soluble
  • Through-hole: no-clean / water soluble
  • No-clean standard on commercial orders
Assembly Supported
  • Single-sided or double-sided
  • Through-hole (PTH)
  • SMD
  • BGA
  • LGA
  • SoP
  • Modules and daughterboards
Mechanical Component Limits
  • Leaded packages (SOIC, QFP, TSOP): 11.8 mil (0.3mm) lead pitch
  • Leadless packages (QFN, TQFN): 11.8 mil (0.3mm) lead pitch
  • BGA / FBGA / LGA: 15.7 mil (0.4mm) ball pitch
  • Chip components (resistors, capacitors): 01005 (10 mil × 5 mil, 0.25 × 0.125mm)
Depanelization
  • V-score and linear blade
  • Mouse bites
  • Fully routed
Machines & Processes
  • Solder paste screen printers
  • Solder paste jet printers
  • SMT pick and place machines
  • Convection reflow ovens
  • Automatic optical inspection
  • PCB automatic board washers
  • Selective and wave through-hole soldering
  • X-ray inspection
  • Manual visual inspection
Conformal Coating
  • Spray and dipping processes
  • Epoxy encasement
  • UV tracer and coverage checks
  • Materials: Acrylic, Silicone, Polyurethane
CAP-03 / ASSEMBLY SMD · BGA · THROUGH-HOLE · IPC-A-610
04 · Design Rules

DRC Minimums & Tolerances

Parameter Imperial Metric
Trace Width (minimum) 3 mil 0.0762mm
Spacing (minimum) 3 mil 0.0762mm
Annular Ring (minimum) 3 mil 0.0762mm
Copper to Board Edge Clearance 3 mil 0.0762mm
Drill Size (minimum) 4 mil 0.1016mm
NPTH Drill to Drill 6 mil 0.1524mm
PTH Drill to Drill 19.69 mil 0.5mm
Paste Aperture (minimum) 6 mil 0.1524mm
Paste Clearance 6 mil 0.1524mm
Silkscreen Size (minimum) 5 mil 0.127mm
Silkscreen Text Height (minimum) 32 mil 0.8mm
Soldermask Dam (minimum) 3.93 mil 0.1mm
Internal Route Radius 31.49 mil 0.8mm
External Route Radius 39.37 mil 1.0mm
Board Thickness Tolerance
  • T < 1.0mm: ±15%
  • 1.0mm ≤ T < 1.6mm: ±10%
  • T ≥ 1.6mm: ±10%
Drill Hole Tolerances
  • NPTH hole size: ±2 mil (±0.05mm)
  • PTH hole size: ±3.15 mil (±0.08mm)
Board Edge Tolerance
  • PCB board edge: ±6 mil (±0.15mm)
CAP-04 / DESIGN RULES TRACE · DRILL · CLEARANCE · TOLERANCE
05 · Quality & Certifications

Our Manufacturing Guarantee

MacroFab Guarantee
  • IPC Class 2 and 3 production
  • Workmanship warranty for one year after manufacturing
  • Information and IP is 100% confidential
  • Transparent communication and order visibility
  • Whatever it takes to get it right, for free
Inspection Standards
  • IPC-A-610 inspection on all assemblies
  • ESD safety procedures
  • PCB assemblies meet Class 2 (Class 3 available)
  • Visual inspection on all assemblies
  • First Article Inspection images for engineering review
  • X-ray for under-package leads (BGA and QFN)
  • Automated optical inspection
ITAR & Export Control
  • ITAR registered
  • Only ITAR-registered self-service PCB assembly platform
  • Supports defense, space, weapons systems, and export-controlled programs
MacroFab Facility Certifications
ISO 9001:2015 IPC Class 2 & 3 ITAR Registered UL Registered
CAP-05 / QUALITY IPC-A-610 · ISO 9001:2015 · ITAR

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