What We Do

PCBA Production Capabilities

Built In North America

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Sourcing

Real-time stock visibility with integrated components suppliers

Turnkey service, inventory, and consignment supported

Alternative sourcing and lifecycle management

Fabrication

2-36 layers

Blind, buried, micro-drilled vias

HDI, castellations, controlled impedance

Flip-chip capable

Encapsulating (Epoxy potting)

14.9in x 14.9 in max board area

Assembly

Through-hole, SMD, hybrid, modules, box builds

Full product assembly

We support double-sided assembly

Cable and wire harness

01005 10 mil x 05 mil

We follow all IPC-A-610 ESD safety procedures

Testing

Quality testing to meet your requirements

Functional testing

Burn-in

Flying probe

RF spectrum testing

Board Level

Capabilities

Surface Finish

ENIG (standard)

ENIPIG

Lead-free HASL

EHG

Copper to Board Edge Clearance

10mil min (0.15mm) - Standard mfg

3mil min (0.07mm) - Extended mfg

Layer Count

Fabrication Processes

Hard gold–supported

Edge fingers–supported

Beveled edges

Flying probe

Castellations

Dielectric Material Families

FR4-TG1785 (standard)

Rogers 4003C

Rogers 4350B

Rogers 4450B

Rigid-Flex

Aluminum

Other: requires custom quote

Controlled Impedance Layers

Supported

Board Area

Max dimensions: 14.9” x 14.9” (378.46mm x 378.46mm)

Minimum billable area: 1 square inch (25.4mm²)

Custom quote required for larger boards

Board Thickness

0.062” (1.6mm) standard

0.008”-0.248” (0.2mm-6.3mm) custom

PCB thickness increments at 0.0004” (0.1016mm)

Board thickness tolerance:

T < 1.0mm: ±15%

1.0 > T<1.6mm: ±10%

T>1.6mm: ±10%

Quality Assurance

Unless otherwise requested, all assemblies are built to meet IPC-A-610H Class 2 Acceptance criteria

Visual inspection on all boards

X-Ray used for manufacturing validation

AOI only over a certain quantity (25 or more)

Holes & Vias

Capabilities

Drill and Mil

Internal rout radius- 0.8mm External rout radius- 1.0mm Laser drill- 4mil-8mil

Mechanical Drill Diameter

10mil min (Standard Drill)

4mil min (Extended Drill)

Laser Drill Diameter

10mil min (Standard Drill)

4mil min (Extended Drill)

Via Options Supported

Blind and buried vias

Back drilled vias

Micro drill vias

Epoxy filled and capped vias

Via Fill

Non-conductive Epoxy

Conductive epoxy

Copper

Mechanical Through Via Aspect Ratio

10 max (standard drill)

16 max (extended drill)

Laser Blind Via Aspect Ratio

Supported as per our minimal drill size in DRC

Copper

Capabilities

Drill and Mil

Internal rout radius- 0.8mm

External rout radius- 1.0mm

Laser drill- 4mil-8mil

Mechanical Drill Diameter

10mil min (Standard Drill)

4mil min (Extended Drill)

Laser Drill Diameter

10mil min (Standard Drill)

4mil min (Extended Drill)

Via Options Supported

Blind and buried vias

Back drilled vias

Micro drill vias

Epoxy filled and capped vias

Via Fill

Non-conductive Epoxy

Conductive epoxy

Copper

Mechanical Through Via Aspect Ratio

10 max (standard drill)

16 max (extended drill)

Laser Blind Via Aspect Ratio

Supported as per our minimal drill size in DRC

Soldermask & Silkscreen

Capabilities

Solder

RoHS/lead-free solder only

SAC305 for surface mount

SN100 only for through-hole

Solder resist: top and bottom standard

Soldermask Colors

Red

Green

Blue

Yellow

Black

White

Matte Black

Dark Brown

Transparent

Light Green

Matte Green

Soldermask Dam

.1mm

Soldermask Pad Relief

Min 4mil

Silkscreen Colors

Red

Green

Blue

Yellow

Black

White

Minimum Silkscreen Size

5mil

Other

Capabilities

Flux

SMT: no-clean

Through-hole: no-clean or water wash

Castellations

Supported

Partner Facility Certifications

AS9100D

UL Registered

ISO13485

ISO/IATF 16949

ISO9001

ISO14001

Assembly Supported

Single-sided or double-sided

Through-hole

SMD

BGA

LGA

PTH

Hybrid

SoP

Daughterboard components

Modules

We support double-sided assembly

Depanalization

Linear blade

Mouse bites

Routed

Component Programming

Supported

Mechanical Limits

Chip components, ex: resistors/ capacitors 01005 10 mil x 05 mil (0.25mm x 0.0125mm)

Leaded packages, ex: SOIC/QFP/TSOP 11.8 mil (0.3mm) Lead Pitch

Leadless packages, ex: QFN, TQFN 11.8 mil (0.3mm) Lead Pitch

BGA, ex: BGA/FBGA/LGA 15.7 mil (0.4mm) Ball Pitch

Conformal Coating

A UV tracer is added to all conformal coating and boards are inspected under a UV light according to certified industry standards.

Acrylic
Silicone
Polyurethane

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